Home └MCL Bootcamp PPT 4 - PCB Materials NON Technical └MCL Bootcamp PPT 4 - PCB Materials NON Technical

MCL Bootcamp PPT 4 - PCB Materials NON Technical

Last update: 05/08/2025

MCL Bootcamp PPT 4 - PCB Materials NON Technical

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PCB Materials NON Technical
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1. What are the two main structural elements of a basic PCB?
Resistors and capacitors Copper foil and soldermask Base material and conductors Prepreg and plating
2. What is a laminate in PCB manufacturing?
A chemical used for cleaning copper A bonding of metal layers with prepreg under pressure The coating applied to pads The topmost etched layer of a board
3. What is the most common resin used in PCB production?
Polyamide Phenolic Epoxy Teflon
4. Which type of copper foil is used for its flexibility and smooth surface?
Annealed copper Rolled annealed copper foil Beryllium copper Electrolytic copper foil
5. What does IPC-4101 specify?
Minimum trace width Rules for component soldering Requirements for PCB laminate materials Gerber file formatting
6. What does glass transition temperature (Tg) refer to?
When copper begins to melt When a resin becomes conductive When a polymer changes from hard to rubbery When the soldermask is applied
7. Which material is typically used in RF applications due to its low dielectric constant?
FR-4 Teflon CEM-1 G-10
8. Why are aluminum or metal core PCBs used?
For aesthetic reasons To allow more flexible layouts For significant heat dissipation To reduce the weight of consumer electronics
9. What property is not affected by environmental conditions like humidity or temperature?
Dielectric breakdown voltage Mechanical strength Trace color Thermal expansion
10. What determines the number of cores used in a multilayer PCB?
Copper thickness Soldermask type Board design requirements Color of silkscreen